Abstract:
We describe the microfabrication,packaging, and testing of an active,dry, scalp electroencephalogram (EEG) electrode. The electrode consists of a silicon sensor subs(tale and a custom circuit substrate (2 #m CMOS technology). A via-holelechnologyhas been developed using reactiveion etchingwilh SFJO2 gas mixture 10 make electricalcontacts between the sensor and circuit subs(rates. These substrates and batteries (power source) are then assembled in a custom package for testingon bench and human subjects.